The Department of Science and Technology of Hubei Province recently organized CPC members and officials on a technological innovation study tour at YASC Wuhan Base to gain an in-depth understanding of the YASC Wuhan Base construction and the R&D progress and industrialization of third-generation semiconductor technologies.

Company leaders including YASC President Chen Zhongguo and Chief Scientist Liu Hongchao elaborated on the technological advantages, application scenarios of silicon carbide (SiC) power devices and the company’s future plans, and demonstrated YASC’s forward-looking layout and hardcore strength in third-generation semiconductors.

Chen Zhongguo highlighted the unique advantages of silicon carbide as a representative material for third-generation semiconductors. As it boasts excellent characteristics such as high temperature tolerance, high voltage tolerance and low loss, silicon carbide plays a vital role in strategic emerging industries like new energy vehicle (NEV), photovoltaic energy storage and smart grid, dubbed the “key heart” in these industries. In view of the global SiC market currently in short supply, to vigorously develop the third-generation semiconductor industry in China, the world’s largest application market, is of critical strategic importance to enhancing the country’s international competitiveness in relevant fields. YASC will claim the mantle and contribute to self-supporting and risk-controllable development of the Chinese wide bandgap semiconductor industry, said Chen Zhongguo.

Liu Hongchao provided insight into the company’s technology R&D roadmap. YASC has followed the “Drive for Dream, Drive for Expectation, Drive for Market, Drive for Zero-loss” R&D strategy, and pressed forward with platform building in a systematic manner, covering new devices, new process platforms and advanced assembly. With its continued R&D investment and technology expertise, YASC has unremittingly improved its core competitiveness and industry influence in third-generation semiconductors, which lays a robust foundation for promoting high-quality development of the wide bandgap semiconductor industry in China. YASC will make sustained efforts in technological innovation and industrialization, accelerate commercializing and applying scientific and technological advances, and help China build a more significant presence in the global wide bandgap semiconductor industry landscape, accented Liu Hongchao.

Going forward, YASC will relentlessly ramp up technological innovation, expedite industrialization, constantly expand application areas in the market, and improve product performance and quality. In the meantime, under the guidance of government departments, YASC will actively strengthen cooperation with research institutions and enterprises up and down the industrial chain, jointly build internationally competitive third-generation semiconductor industry clusters, and inject new impetus into high-quality development of the Chinese wide bandgap industry.