Material Lab conducts research on basic scientific issues and core industrial technologies of wide bandgap semiconductor SiC materials. It studies formation, evolution and annihilation of defects in SiC materials, the impact of defects on the performance and reliability of epitaxial layers and devices as well as their correlation, epitaxial technology development and industrial application, and material characterization technology development and industrial application, to achieve breakthroughs in SiC material science and technology, overcome key industrial technologies, and solve a series of technical difficulties with “bottlenecks” in the SiC field.

Chemical Analysis Lab is mainly designed to meet the chemical analysis requirements at wafer fabs, and complete monitoring microelements or trace elements in chemicals and ultrapure water, metal contamination on the wafer surface, and air pollution in the production environment at wafer fabs.

Reliability Testing Lab is a laboratory dedicated to product reliability testing and evaluation. Reliability testing is an activity conducted to evaluate whether a product maintains functional reliability in a specified lifespan under all environments where it is expected to be used, transported or stored. Usually the product is exposed and subjected to natural or artificial environmental conditions to evaluate the performance of the product in the environmental conditions of actual use, transportation and storage, and analyze and study the degree of influence of environmental factors and how they work.

Failure Analysis Lab mainly conducts analysis using electrical testing and a variety of advanced physical, metallographic and chemical analysis techniques, in combination with specific circumstances before and after the component failure and relevant technical documents, to verify the reported failure and identify the component failure mode, failure mechanism and cause of the failure. Through comprehensive and systematic failure analysis, it can identify the causes of failure, provide guidance for device design, manufacturing process, experiment or application improvement, and help take appropriate corrective measures to eliminate the causes of failure mode or mechanism, so as to realize the device reliability improvement.

Product Characterization Lab is mainly used to extract the static and dynamic electrical and thermal characteristics of products. It is equipped with a Keysight B1506A Power Device Analyzer / Curve Tracer, a High and Low Temperature Test Chamber, a Tektronix DPT1000A Dynamic Parameters Tester 1000A, a Xi’an Zhiying ZY-IFSM-1000 Surge Tester and an Analysis Tech Phase12 Thermal Analyzer.The Lab can test static electrical characteristics (high temperature, low temperature and normal temperature), dynamic electrical parameters (high temperature and normal temperature) and thermal resistance of SiC power devices.

Product Application Lab uses advanced and sophisticated instruments and equipment with high precision, high stability and high performance. The high-precision power system can address building and testing DC/DC, OBC, charging stations, photovoltaic inverter systems and energy storage systems in new energy vehicles; the high-performance reactive power and towing test system can address building and testing a traction inverter system.

The Lab has high-end complete configuration and professional rigorous design, aiming to create an advanced first-class laboratory. The test system can cover simulation tests in industrial and automotive fields to ensure scientific and reliable test results.