A team of China Huaxin directors including Chairman Yuan Xin, Director, Party Secretary and CEO Ma Jie, and independent directors Hou Hongxiang, Tong Yunxiang, Zhang Jinsong and Cui Jiuheng, conducted research at China Huaxin’s member company YASC in Wuhu City, Anhui Province on September 6, 2023, learned about the relevant operating conditions, and guided the company’s future planning work.

In a meeting at the YASC headquarters, the team of China Huaxin directors learned details about YASC’s business layout, technical strength and main products. Chen Zhongguo, President of YASC, introduced to the research team that the company has an annual capacity of 60,000 6-inch silicon carbine (SiC) MOSFET or SBD epitaxial and bare wafers. In the meanwhile, YASC officially held the Wuhan Base groundbreaking ceremony on September 1. The Wuhan Base project can produce 360,000 SiC MOSFET wafers a year, including epitaxy, device design, wafer manufacturing and assembly. The construction in the first phase is expected to be completed in 2025. Wuhan Base will then become the largest SiC power semiconductor manufacturing base in China, and the company will be an absolute industry leader in production capacity.

Yuan Xin, Chairman of China Huaxin, later had an in-depth discussion   with the YASC team on the yield rate and market prospect of SiC products in the next few years, and provided valuable advice to the company on the strategic development positioning and the business performance improvement.

In addition, the research team also visited the YASC SiC wafer fabrication plant, the newly completed headquarters building and the showroom, and focused on YASC’s development history and main achievements as well as the development of the third-generation semiconductor industry represented by silicon carbide.