Today, the electric drive systems in new energy vehicles (NEVs) are advancing toward higher power density, smaller size and lower cost at a faster pace. Traditional potted or molded modules have reached the performance ceiling, making it difficult for them to meet the stringent requirements of next-generation automotive-grade traction inventers. The PCB embedded technology has sprung up — by embedding the power chip directly into the PCB and using the copper layer for interconnected thermal conduction, it significantly reduces parasitic parameters and thermal resistance, and improves power density and reliability. The technology not only provides a viable solution to industry pain points, but will also reshape the power semiconductor packaging industrial chain landscape, and drive the evolution of automotive-grade traction inverters and even the entire power electronics sector toward very large scale integration (VLSI).

Read the white paper to learn about the key path to next-generation power semiconductor packaging. Stay tuned for more updates on new embedded automotive-grade power modules at the “Everest · Four-Year Long March of Technology” YASC Technology Showcase!