The automotive-grade SBD 650V 30A product, contract manufactured by YASC, has recently entered mass production, and passed the automotive-grade certification audit by an automotive end customer. The development not only demonstrates YASC’s technology capabilities, but also marks a new journey of its automotive-grade silicon carbide (SiC) products in large-scale application.
There are clearly higher safety and reliability requirements for power devices in the automotive sector, compared to industrial and consumer electronics domains. Automotive-grade certification and customer certification audit are the fundamental prerequisite for chipmakers to enter the supply chain of automakers and Tier 1 suppliers. In particular, vehicle manufacturers have more stringent supplier audit systems, besides standard certifications. Generally speaking, only by passing the vehicle manufacturer’s audit can a chip be truly integrated into the complex electrical/electronic (E/E) architecture and put into use in the vehicle.
To better serve the needs of automotive and industrial customers, YASC has organized relevant teams to study and strictly implement automotive industry standards such as IATF16949 and VDA6.3 over recent years. It has clearly laid out quality goals and access standards for automotive-grade control, and based on this, established an automotive-grade control and management document system covering research and development, manufacturing, inspection and testing, and delivery and after-sales service. The company has built a comprehensive traceability mechanism across the process from wafer new materials to finished product shipment.
On that basis, coordinated management and regular evaluation of upstream wafer suppliers were combined. After several months of effort, the automotive-grade SBD 650V 30A product project team at YASC Wuhu Base ultimately ensured that the product passed the customer’s second-party audit and automotive-grade product certification, and entered mass production in May 2026.
The certified product was designed and developed by the customer, and manufactured at YASC Wuhu Base. In the in-vehicle device domain, it is mainly used in motor drives and switched-mode power supply (SMPS). Compared to silicon-based diodes, the product can effectively improve system efficiency, support higher frequencies/higher power density, and deliver greater system reliability. Meanwhile, it also features lower forward voltage, lower reverse leakage current and faster switching speed, and its extremely switching loss and excellent reliability are highly recognized by customers.
The customer’s audit certification is a test of best practices for automotive-grade products. In the face of the explosive growth of new energy vehicles, YASC will continue to make breakthroughs in key technology fields of third-generation semiconductors, represented by silicon carbide. At the same time, it will work with upstream and downstream partners in the industrial chain to build a more self-supporting and risk-resilient in-vehicle electronics supply chain, and drive new energy vehicle and third-generation semiconductor industries towards high-end, self-reliant and global development at a faster pace.
